With 40 years in the semiconductor industry. Cormac Michael O’Connell currently leads TSMC (Canada)’s Memory Design Group which delivers a range of TSMC’s memory compilers enabling billions of customer products across the world on TSMC’s next generation technologies. In the past he has developed SRAM, DRAM, MRAM products and high-speed, low-power memory PHYs, merged Memory and Logic SoCs for applications in PC graphics, routers, and security, as well as RF products for Bluetooth, WLAN and cable modems. Cormac’s goal is to build semiconductor businesses that deliver customer value and provide colleagues with challenging opportunities. He is interested in embedded memory solutions, design services, memory compilers, mixed-signal IO PHYs, BIST, and BISR. He is always seeking talented engineers in memory, analog, mixed-signal, and ASIC design, especially those experienced with cutting-edge CMOS technologies. His specialties include building and managing semiconductor engineering teams and business development in the semiconductor sector.
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