Valérie Oberson obtained her bachelor’s degree in biochemistry and her master’s degree in environmental sciences from the Université de Sherbrooke.
She joined IBM in 1991.
She first worked in the environmental sector for 3 years, then joined the 9211 ceramic plating team in the technical support of the Electroless gold plating process.
In 2000 her career in development began when she joined the team in charge of the development of the new C4NP bumping technology, which subsequently became the standard for IBM’s microelectronics division until 2012.
In 2006, she began her career as a Technical Professional in the BA Development team, as an integrator of the Chip Join group.
In 2014, Valérie was promoted to Senior Technical Professional in charge of the plant’s technology roadmap, the competitive analysis group, and the industrial research chair with UDS.
In 2022, Valérie was appointed Senior Member of the Technical Team: Assembly Technologies and Integration.
Valerie has been a member of the C2MI scientific committee for several years. She has also been a member of C2MI’s Board of Directors since 2022 and recently joined C2MI’s Eco-Responsible Projects Governance Committee in 2023.
Valérie holds 16 patents and is the author/co-author of several technical papers.
For more than 10 years, Valérie has been actively involved in the Electronics Components and Technology Conference (ECTC) as a member and/or session chair for the Assembly and Manufacturing Technologies committee.